Specifications include, but are not limited to: Must be able to accommodate 150 mm diameter wafers Must be able to cut silicon, glass, quartz, and other crystalline materials such as lithium niobite (i.e. capable of handling a variety of blades for different applications) Must have blade breakage detection Must have a y axis index positioning accuracy of 5 um or better over full range Must have Z axis repeatability of 5 um or less Must have non-contact z height setup Must have kerf check function Must have auto focus function Smallest footprint possible to save space in lab for additional equipment Fast cutting speed of >50 mm/s Must include options for filtering and/or purifying cooling water and for drying and dehumidifying compressed air. This is because the air and cooling water in Cobleigh Hall probably does not meet the specifications for most dicing saws. Our deionized water is sufficient for blade cooling
