Specifications include, but are not limited to: Non-contact, non-destructive, native 3D measurement (i.e. not stylus based) Great surface roughness measurements, i.e. on polished silicon (Z resolution <1 nm) Must be able to maintain resolution at low magnifications (i.e. at 2.5x or 5x) At least two objective lenses with the option of at least 4, ranging from 5x to 100x (i.e. 5x and 50x, 2.5x and 100x, etc., preferred 5x and 50x) Must be able to measure samples with widely varying reflectance (~1% to ~99%) Capable of measuring steps heights of at least 1 mm (Z range) Capable of measuring large and unknown lateral areas (capable of stitching multiple measurements) Capable of automated measurements across a 100 mm diameter wafer for process development (i.e. motorized and automated stage) Must include computer and display with software for analysis Must have cloud-based data storage and online data analysis for ease of use for wide user base Capable of infinite focus imaging for publication quality images Must have very functional software with step height measurement, leveling, terms removal, etc. (i.e. must have a range of automated funcitons)
