Qty 1 Advanced oxide etch tool for Inductively Coupled Plasma etching of fused silica wafers with photoresist masks. Required Specifications for Advanced oxide etch tool for Inductively Coupled Plasma etching of fused silica wafers with photoresist masks: 1. The system must be tooled for 100 mm fused silica wafers with a standard wafer flat. 2. The system must have a vacuum-compatible load-lock for transferring substrates into and out of the process chamber. 3. The process chamber must include a mechanical substrate clamp with helium backside cooling to ensure effective thermal management, thereby eliminating surface roughness on the etched wafer. 4. The system must have a heated chamber and chamber liner to minimize process deposition, with a maximum temperature of 60 °C. 5. Backside helium pressure must be at least 10 Torr and managed so that fused silica wafer thickness from 0.5 mm to 1 mm thickness can be accommodated. 6. The lower electrode must be temperature-controlled, -20 °C to +60 °C, for substrate heating/cooling. 7. The system must have at least 2000 W ICP power at 2 MHz with an impedance matching network. 8. The system must have at least 300 W Bias power (RIE) at 13.56 MHz with an impedance matching network. 9. The system must have a minimum of 8 gas lines for O₂, CHF₃, C4F8, Ar, CF₄, SF₆, N2 with high-precision Mass Flow Controllers (MFCs). 10. The system must have a demonstrated tunable etch selectivity for 1 mm-thick 100 mm-diameter fused silica wafers using O2/CHF3 gases (SiO₂:resist) from 0.2:1 to 2:1 with minimal surface roughness to provide optical quality transmissive optics. 11. The etch uniformity must be < ±2.5% across 100 mm fused silica wafer. 12. The chamber pressure must be 5 - 100 mTorr (closed-loop control). 13. The system must have a control PC for operation, data management handling, and remote system operation. 14. The system must have a delivery date within 6 months from time of purchase. 15. New equipment only. 16. Price must include shipping and delivery. 17. A warranty of at least one year must be included. 18. Installation and training must be included in the package. 19. Software with suitable number of licenses (if applicable) must be included.
