- The system should be able to do at least two bonding types, such as wedge, ball, and/or ribbon. - The system should possess the ability to work with multiple standard wire bonding materials, such as gold, aluminum, or others commonly found in microelectronics packaging usage. - The system should possess at least some automated features, such as motorized wire feeding, tail length control, and ball size control. - The system should possess a heated stage. - Stage size is preferred to be at least 100 mm or 4 in on a side or in diameter. - The system should be capable of electronic control, storage, and swapping of bonding parameters. - The system should include a microscope for viewing the working area of the stage.
