Specifications include, but are not limited to: QTY 1 Compact mechanical milling system to produce single or double-sided and multilayer prototype PCB1s including surface copper/metal removal, controlled pocket milling, drilling and cutting; multilayer processing support when used with LPKF lamination press. Working area 9” x 12” x 1.6” (z-axis clearance) and 0.3" or 8mm (max pocket depth for 2.50 operations) with 0.47 um resolution (0.02mil). Includes: High speed spindle motor adjustable 10,000-60,000 rpm, 15 position auto-tool change, auto switch sensor for automated tool depth adjustment with +/- l um cut depth precision, fiducial alignment camera, vacuum table, 2.5D depth milling, solder paste dispensing, solid granite base construction for high accuracy, acoustic/safety cabinet, and LPKF CircuitPro software.