Purpose/Scope of Purchase: The LSU Department of Civil and Environmental Engineering is purchasing a 3D Digital Image Correlation (3D-DIC) system with integrated thermal imaging for advanced materials testing, particularly to capture full-field deformation, strain, and temperature data. This equipment will support ongoing experimental research under both quasistatic and dynamic loading conditions. The system must meet or exceed the following specifications. System Specifications: • Two digital cameras with a minimum resolution of 2448 × 2048 pixels, frame rate ≥ 50 fps, and C-mount compatibility. Lenses must be f/2.8 with a 50 mm focal length or equivalent. • A set of extension rings (0.5, 1, 2, 5, 10, 20, 40 mm) and polarizing filters. • One thermal imaging camera with a resolution of 640 × 480 pixels, frame rate ≥10 Hz, temperature range −20 °C to +2000 °C, and a 24° field of view lens. Camera must support integration with optical image correlation software. Calibration target set able to calibrate fields of view from 4mm to 450mm. • Eight aluminum targets (FOV: 1–18"). • IR calibration target which allows for IR camera data to be viewed in the DIC post-processing software alongside the white light camera data, including fullfield temperature vs strain plots. • Motorized or automated calibration target holder allowing predefined tilt-angle control through acquisition software. One glass grid set with backlit fixture (FOV < 1"). • One 8 × 6 calibration target for IR camera with 5.25 mm spacing. • Motorized calibration system capable of handling calibration targets for fields of view between 30–110 mm. • One data acquisition system with ≥6 analog channels, each supporting ≥10 kS/s sampling rate, and digital trigger capability. • Wi-Fi based image acquisition remote, which controls exposure time and image capture for white light cameras. • Two Blue LED Lighting Systems with Positioning Arms and linear polarizing filters. • Full-field 3D DIC strain analysis software with 2D analysis capability. • Wheeled workstation with integrated Rack-mount Windows OS PC. • IR image acquisition software that supports synchronized thermal and optical image capture. • Real-time 3D DIC strain monitoring software modules.
