5.2.1 The proposed tool should offer the capability to dice silicon, quartz, sapphire, and glass wafers. 5.2.2 Substrate holder should be able to accommodate small, odd-shaped pieces up to 300mm wafers. 5.2.3 The proposed tool should allow making a single cut through any sized wafer or piece of wafer by selecting the cut location via a graphical user interface. 5.2.4 Ability to dice a full wafer in both x and y directions (and if possible, non-normal directions), making multiple cuts per direction to dice individual chipsDicing locations should be addressable via the graphical user interface. 5.2.5 Inclusion of a consumables kit is preferred. 5.2.6 The tool should come with a warranty. The length and coverage will be part of review. 5.2.7 The tool should come with shipping (including payment of import tariffs), installation, start-up and training
