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Waipahu District Park Swimming Pool Electrical Bonding Improvements


Location
Hawaii
Publication Date
09/26/2019 10:54 AM EDT
Closing Date
10/18/2019 08:00 PM EDT
Issuing Organization
City and County of Honolulu
Solicitation Number
Description

Specifications include, but are not limited to: The project is to install a new electrical bonding infrastructure in the Waipahu District Park swimming pool. Existing concrete pavement will be removed and re-paved to install new bonding conductors. All existing metallic components of the pool will be rebonded to the new bonding grid. Furthermore, the existing pool lights and niche shell will be removed and replaced with new pool lights and niche shell, which will be bonded to the new bonding grid. Bond testing will be performed to ensure that the pool is properly grounded.

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